Electronics & Communications
The world of electronics and communications is fast-paced and ever changing. Dow’s clear view on the future and development of technologies at, and often ahead of, industry and related category trends keeps you globally competitive and ahead of the game. Dow Electronic Materials technologies have become critical to the industry, such that 95% of smart devices on the market are manufactured using Dow innovations.
Whether your goal is to develop more vibrant flat screen displays or to develop faster, more powerful computer chips, Dow works with you to define the challenge and deliver a unique solution, every time.
Copper barrier chemical mechanical polishing pads
VISIONPAD™ VP3100 Barrier CMP Pad Barrier chemical mechanical planarization (CMP) pad VISIONPAD™ 5000 Polishing pads for use in STI applications with ceria-based slurry VISIONPAD™ 3500 Polishing pads for metals with advanced polishing requirements VISIONPAD™ 5200 A high removal rate pad designed for Tungsten, ILD, and Copper Bulk applications. VISIONPAD™ 6000 This is a low defect, high planarization pad specifically designed for ILD and Bulk Copper applications.