Electronics & Communications
The world of electronics and communications is fast-paced and ever changing. Dow’s clear view on the future and development of technologies at, and often ahead of, industry and related category trends keeps you globally competitive and ahead of the game. Dow Electronic Materials technologies have become critical to the industry, such that 95% of smart devices on the market are manufactured using Dow innovations.
Whether your goal is to develop more vibrant flat screen displays or to develop faster, more powerful computer chips, Dow works with you to define the challenge and deliver a unique solution, every time.
Machines designed to laminate a full range of PCB
Automatic Cut Sheet Laminator 1600-SPC/T To laminate PCT upt to 12,7 mm (0.5in.) thickness. A data management system supervises and statistically controls the process. Pre-tack lamination is allowed Automatic Laminator 1600 T To laminate a full range of PCBs up to 5 mm (0.2 in.) thickness Automatic Cut Sheet Laminator 1600-G To laminate a full range of PCBs up to 5 mm (0.2 in.) thickness. A Data management system supervises and statistically controls the process Manual Laminator XRL 360 To laminate dry film photoresist to PCBs and chemical milling parts up to 915 mm (36 in.) thickness Manual Laminator ML 3024 To laminate dry film photoresist to PCBs and chemical milling parts up to 610 mm (24 in.) thickness Semi-Automatic Laminator SA 3024 OC To laminate dry film photoresist to PCBs and chemical milling parts. Suitable for cold application of DFSM on PCBs too Laminator Roll-To-Roll RTR 3024 Laminator for easy roll-to-roll materials dry film resist lamination with hot rolls, single- or double-sided