Products
Electronics & Communications
The world of electronics and communications is fast-paced and ever changing. Dow’s clear view on the future and development of technologies at, and often ahead of, industry and related category trends keeps you globally competitive and ahead of the game. Dow Electronic Materials technologies have become critical to the industry, such that 95% of smart devices on the market are manufactured using Dow innovations.
Whether your goal is to develop more vibrant flat screen displays or to develop faster, more powerful computer chips, Dow works with you to define the challenge and deliver a unique solution, every time.
- ACCELERATOR
Pretreatment process step prior to electroless copper plating, to increase activity of catalyst material. In Plating on Plastics applications, also serves to remove excess catalyst from plating racks and stop-off paints. - ACCUMULATOR
Compact modules for receiving and storing innerlayer or rigid panels during printed wiring board manufacture. - ACID CLEANER
Pretreatment process used to prepare substrates for electroless or electrolytic plating - ACTRONAL™ Activators
Acidic descaler designed for the removal of oxides and heat scale from iron/nickel-based alloys - ACuPLANE™ Series of Advanced Barrier Slurries
Barrier slurries for low-k copper wafer polishing - Advanced Ceramics
Highly pure CVD silicon carbide for high performance ceramic parts - ALKASTRIP™ Photoresist Stripper
Concentrated alkaline liquid used to strip aqueous dry films used for patterning of printed wiring boards - ALUPREP™ BP Cleaner
Acidic soak cleaner for removal of contaminants and preparation of aluminum substrates used in semiconductor wafer packaging applications for metallization processes - AMBERJET™ and DOWEX™ MONOSPHERE™ Ultrapure Ion Exchange Resins
Uniform ion exchange resins for the production of ultrapure water. - AMBERJET™ UP and AMBERLITE™ UP Semi-conductor Grade Ion Exchange Resins
Semi-conductor grade ion exchange resins - AR™
Anti-reflectants for front-end and back-end lithography - ASPUN™ Fiber Grade Resins
Provide cloth-like haptics for nonwoven outer covers - AURALL™ Plating Baths
Gold plating processes for electronic finishing applications - AURO DURE™ Plating Baths
Near neutral pH gold electroplating process providing compressively-stressed lustrous deposits - AURO STRIKE™ Plating Baths
Gold strike processes for stainless steel, copper, nickel, and copper/nickel alloy substrates - AUROFAB™ BP Plating Bath
Electrolytic gold process developed for applications that require pure, soft gold deposits for electronic applications - AUROJET™ Plating Baths
High speed electroplating process for bright yellow, ultra-pure, semiconductor quality gold deposits - AUROLECTROLESS™ Immersion Plating Baths
Pure immersion gold plating solution for electroless nickel immersion gold (ENIG) or electroless nickel electroless palladium immersion gold (ENEPIG) applications - AURONAL™ Plating Baths
Pure gold plating process - AUROVEL™ Plating Baths
Soft gold electroplating process designed for wire bonding applications. - Battery Materials
Dow provides a differientiated solution for battery cycle life improvement through a proprietary coating process. - BLACKBIRD™ Resists
Laser-ablation resist electrodeposited from an aqueous emulsion and anaphorectically deposited on to electrically-conductive substrates - CARBITOL™ Solvent
Solvents that provide a good balance of volatility, solvency and water solubility for such applications as coatings and printing inks - CARBOWAX™ PEGs and MPEGs
A wide range of uses in household products, including cleaners, polishes, soaps and detergent. - CATALYST BP Activator
Catalyst for uniform activation of copper substrates for electroless nickel plating - CATAPOSIT™ Colloidal Catalysts
Colloidal catalyst baths for activation of non-conductive substrates for electroless plating - CATV Insulation
Solid and foamable (expandable) insulation materials - CATV Insulation Compounds
Solid insulation compounds for voice and data applications - Chlorinated Organics
Chlorinated solvents and intermediates are used in refinery and petrochemical production applications to revitalize and regenerate catalysts. - CIRCUBOND™ Adhesion Promotion
Peroxide sulfuric-based adhesion promotion treatment for printed wiring board inner layers - CIRCUPOSIT™ Metallization Products
Electroless copper plating processes for printed wiring board (Making Holes Conductive / MHC) - CLAROSTAN™ CT Bath Purifiers
Liquid clarifiers for the precipitation of suspended solids in plating solutions - CLEANER-CONDITIONER
Processes to prepare dielectric surfaces for electroless copper deposition, while enhancing deposit adhesion - Cleaning Unit HI-TAC
Module for removing contaminant particles from panels - CONDITIONER BP
Ensures selective deposition of electroless nickel in wafer bump metallization applications - CONDUCTRON™ Metallization Products
Direct metallization for activation of dielectric substrates for flexible and rigid printed wiring board applications - Controllers
Automatic replenishment systems designed for use with developer chemistry - COPPER GLEAM™ Plating Baths
Bright acid copper electrolytic plating processes - Cover Sheet Remover CSR
Automatic mylar remover within a dry film process line - CRIMSON™ Metallization Products
Direct metallization for activation of dielectric substrates for printed wiring board applications for flexible and rigid printed wiring board applications - CUOX™ Regenerant
Chemical regenerant for copper etchants used for imaging materials applications - CUPOSIT™ Electroless Copper
Electroless copper deposits for metallization of dielectric substrates - CUPROETCH™ BP Etch
Etchant specifically formulated for etching copper seed layers on wafer substrates - CUPROTEC Tarnish Inhibitors
A process for preventing the tarnishing of copper and copper-based alloys by atmospheric corrosion - CUS™ 1300 slurries
Barrier slurries for copper chemical mechanical planarization (CMP) - CVD PRECURSORS
High purity sources for vapor phase epitaxy - D.E.H.™
Epoxy Curing Agents for a broad range of applications - D.E.N.™
Epoxy Novolac Resins with multi-purpose functionality for high temperature applications. - D.E.R.™
Epoxy Resins offering high purity and uniform performance across a broad range of applications. - DEVELOPER BP
Metal-ion-free developer containing surfactants, designed to provide high throughput and wide processing latitude for wafer applications - Deviator
Handling solutions for automatic lines and small spaces - Diazo Developer
Master copy developer for imaging materials applications - Dow Elastomers
Specialty materials and performance elastomers - DOW ULTRAFILTRATION for UPW
Hollow fiber, pressureized ultrafiltration modules and preassembled skids for pretreatment of UPW. - DOWANOL™
Hydrophilic glycol ethers used in a broad range of applications, including coatings, cleaners and printing inks - DOWEX™
Ion exchange resins - DOWLEX™ Polyethylene Resins
Well suited for a wide variety of applications in blown and cast film - DOW™ Electrodionization Modules
Unique spiral wound EDI modules for polishing ultrapure water. - DOW™ Epoxy Resins
Liquid epoxy resins; solid epoxy resins; epoxy novolac and bis-F resins - DOW™ High Density Polyethylene (HDPE) Resins
Provide toughness, rigidity and strength for many blow molding applications, film products, and extruded and injection molded items - DURAPOSIT™ Electroless Nickel
Electroless nickel plating processes for printed wiring board and industrial finishing applications - DURAPREP™ Pretreatment Products
Pretreatment products designed for applications including preparing sputtered aluminum on semiconductor wafers and subsequent plating with electroless nickel - EAGLE™ Resists
Electrophoretically deposited photoresists for imaging of complex geometry substrates such as printed wiring boards - ECHELON™ Polyurethane Prepolymers
For fast curing adhesives and binders - ELECTRO GLO™ Electropolish
Anodic electropolish for copper and copper alloys - ELECTROPOSIT™ Plating Baths
Copper electroplating baths for printed circuit board applications - ENGAGE™ Polyolefin Elastomers
Polyethylene (PE) based with a high degree of comonomer - ENLIGHT™ Materials
Suite of products for photovoltaic (solar cell) imaging, metallization and encapsulation applications - ENLIGHT™ Polyolefin Encapsulant Films
ENLIGHT Polyolefin Encapsulant Films can enhance efficiences in photovoltaic module production and help lower total system costs. - ENVIROSTRIP™ Metal Strippers
Metal strippers for removal of tin and tin/lead deposits - EPIC™ Photoresist
193 nm photoresists for microlithography applications - Ethylene Glycols
Function as versatile intermediates. - Ethylene Oxide (EO)
A versatile intermediate - EVERON™ BP Electroless Nickel
Process designed to autocatalytically deposit semi-bright nickel-phosphorous alloys, containing 8-10% phosphorous, onto catalyzed copper and aluminum surfaces on silicon wafers - Expandable Insulation Compounds
Provides best insulation aging performance in grease-filled applications - Exposure Unit EU
Exposure units for primary imaging and solder mask photoimaging - Filler Coater DF
Processes panels with a thick-copper track-filling system - Finishing Pads
Poromeric pads for semiconductor wafer polish - FLEXOMER™ Very Low Density Polyethylene (VLDPE) Resins
These resins add excellent strength, toughness and flexibility to help improve products. - FORTEGRA™
Epoxy tougheners that can be used across a variety of epoxy applications, and provide toughness without sacrificing glass transition temperature of the final coating or composite - Glycidyl Methacrylate
Get to know the versatility of our high quality glycidyl methacrylate (GMA) functional monomer. Outstanding chemical resistance and weatherability make GMA an excellent choice, but versatility is its most important feature. GMA can be tailored to meet a wide variety of demanding specifications. With versatility and unique capabilities, you’ll be covered for a wide range of high-performance coatings applications, from automotive and electronics to civil engineering, industrial coatings and much more. - GRAPHITE™ Direct Metallization
Direct-plate process that eliminates the need for electroless copper in the "Making Holes Conductive" process during printed circuit board - Haltermann Products
Source for hydrocarbon-based specialties and solvents - HYPERLAST™ Polyurethane Systems
For concrete maintenance applications - IC1000™ Pads
Chemical mechanical polishing pads - Infrared Materials
CVD zinc-based materials for use in optical applications - INFUSE™ Olefin Block Copolymers
Customers can count on Dow to help them innovate and excel. - INTEGRAL™ Adhesive Films
INTEGRAL™ adhesive films are the versatile adhesive solution you've been looking for. - INTERVIA™ 3D-N Dielectrics
Aqueous-based, negative-tone imageable dielectric material that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition - INTERVIA™ 3D-P Dielctrics
Aqueous-based, negative-tone imageable dielectric material that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition - INTERVIA™ BP Resist Stripper
Photoresist stripper products - INTERVIA™ Developers
Developers for use with photoresists and photodielectrics in advanced semiconductor packaging applications - INTERVIA™ Photodielectrics
Photo-imageable dielectric materials for variety of advanced packaging wafer processes - INTERVIA™ Plating Baths
Copper electroplating processes - Ion Exchange Resins
Deliver significant performance advantages over conventional resins with normal or Gaussian particle size distribution - ISONATE™
ISONATE™ modified MDI is a polycarbodiimide-modified diphenylmethane diisocyanate that is liquid at room temperature. - Jacketing Compounds - Black & Colorable
Low Density Polyethylene (LDPE) black jacket for general purpose cable jacket, low moisture uptake, die-drool resistant - KLEBOSOL™ Slurries
Colloidal slurries for chemical mechanical planarization (CMP) - LAMINAR™ Dry Film Resists
Dry film photoresists - Laminators
Machines designed to laminate a full range of PCB - LIGHTLINK™ Waveguide Materials
Optical Waveguide Technology for forming planar, polymeric optical interconnects - Loader/Unloader
Accepts and stores flexible or rigid panels received from a line, in addition to automatically feeding a line for a variety of applications - Low Voltage Power Cable Insulation Compounds - Black
Silane-ethylene copolymer for use in power cable applications - Low Voltage Power Cable Insulation Compounds - Colorable
Colorable bimodal high-density polyethylene jacketing compound for both power and telecommunications jacketing - Low-halogen Flame Retardant (FR) Crosslinkable
CV curing for automotive and appliance wire insulation and control cable insulation - Low-halogen Flame Retardant (FR) Thermoplastic
Solid insulation for electronic wire insulation - MCPR™
i-Line photoresists for microlithography applications - Medium and High Voltage Power Cable Insulation Compounds
Insulations designed to have an extremely low level of additive bloom for a very long storage life - Medium and High Voltage Semiconductive Power Cable Shields
Supersmooth, extra-clean semiconductive compounds - MEGAPOSIT™ SPR™
i-Line photoresists for microlithography applications - MICROFILL™ Microvia Electroplating Products
Direct current electrolytic copper plating processes enabling the densification of printed wiring boards - MICROPOSIT™ EBR
Edge bead remover - NEUTRA RINSE™
Post-rinse for tin plating processes - NICKEL GLEAM™ Plating Baths
Single-additive process for producing nickel-phosphorus deposits - NICKELSTRIP™ CF
Stripping agent for removing electrolytically-deposited nickel from steel and copper alloys - NIKAL™ Plating Baths
Nickel electroplating processes - NIPLATE™ BP Electroless Nickel
Electroless nickel plating systems - NIPOSIT™ Electroless Plating Baths
Electroless nickel plating processes - NO TARN™ Post-Treatments
Immersion post-treatment processes for packaging technologies - Non-halogen Flame Retardant (FR) Crosslinkable - Colorable
CV Curing for automotive and appliance wire insulation - Non-halogen Flame Retardant (FR) Thermoplastic - Black
Black jacket for various telecom and industrial applications - NORDEL™ IP Hydrocarbon Rubber
In a fast-paced industry, you need top quality products that will meet your needs while saving time and money. NORDEL™ IP Hydrocarbon Rubber offers excellent performance and unmatched processing advantages making it the ethylene-propylene-diene monomer (EPDM) of choice. - Oxygenated Solvents
These products offer exceptional benefits across a broad range of applications - PALLADEP BP Electroless Plating Baths
Electroless deposition processes for palladium - PALLADURE™ Plating Baths
Electrolytic palladium plating processes - PALLAMERSE™ Electroless Plating Baths
Plating processes to apply electroless palladium to printed wiring boards for SMT assembly applications - PALLAMET™ Electrolytic Plating Baths
Palladium-nickel electrolytic plating processes - PAPI™ POLYMERIC MDI
Highly versatile due to its low viscosity - PAUROBOND™ Electroless Plating Chemistry
Pretreatment and electroless plating processes for application of electroless palladium to printed wiring boards for PC boards & electronic devices - PHOTOPOSIT™ Resists
Liquid photoresists for printed circuit board manufacturing - POLITEX™ Pads
Chemical mechanical polishing pads - Polypropylene Glycols and Copolymers
Skin conditioning agents, solvents, and surfactants/ emulsifiers for use in a wide range of formulations. - Polyurethane Systems
Rigid polyurethane foams for building panels and prefabrication - PORE BLOCKER™ Post-Treatments
Aqueous pore-blocker process for the corrosion resistance enhancement of gold, silver, or copper plated surfaces - Power Start-Up Compounds
PE-based purge compound is advanced compound that provides rapid and economical cleaning of plastic processing equipment - PRE-HEATER PH
Compact unit designed to heat the panel to be laminated with dry film photoresist - PREPOSIT™ Pre-treatmet Products
Etch and cleaner baths for manufacturing of printed wiring boards - Propylene Oxide
Used in a wide variety of end-use applications - PRX™
Advanced removers for post-etch and bulk removal applications - Refrigerated Finish Unit
Quickly cools dry film laminated panels - RESOLVE™
A concentrated aqueous photoresist developer system for imaging materials applications - RONACLEAN™
Pretreatment products used prior to metallization - RONACLEAN™ CP Cleaner
Soak/electrolytic cleaning solution with low chemical oxygen demand value for primary cleaning of steel and copper substrates - RONACLEAN™ GP Cleaner
Alkaline soak or electrolytic cleaner for primary cleaning of most metals - RONAMAX™ Electroless Plating Baths
Electroless nickel plating processes - RONAMERSE™ SMT Catalyst
Catalyst designed for PWB metallization applications - RONASALT™ Acid Salts
Water soluble powder products used to replace most liquid acids in metallization applications - RONASHED™ Post-Treatment Processes
Electrolytic neutral removal process - RONASTAN™ Electrolytic Plating
Electroplating processes to produce uniform, matte coatings of pure tin - RONATAB™ Activators
Processes to activate passivated nickel and nickel-based alloy substrate surfaces - RONOVEL™ Electrolytic Plating Baths
Alloyed gold plating processes for electronic finishing applications - SHIPLEY BPR™
Ancillary products used with photosensitive materials for advanced semiconductor packaging applications - SILVER GLO™ Electrolytic Plating Products
Electrolytic bright silver plating processes - SILVER STRIP™ Metal Strippers
Alkaline, non-cyanide single-component electrolytic silver stripper - SILVERJET™ Electrolytic Plating Baths
High-purity silver electroplating processes - SILVERJET™ Post-Treatments
Post-plating processes for the enhancement surface properties of silver-plated surfaces - SILVERJET™ Pre-Dips
Pre-treatment processes for copper and copper alloy substrates prior to silver plating operations - SILVERON™ Plating Products
Autocatalytic Silver process designed to produce pure, dense silver deposits onto copper substrates. - SOLDER STRIP™ Metal Strippers
Tin and tin-lead strippers for stainless steel and copper alloy substrates - SOLDERON™ Electrolytic Plating Baths
Tin electroplating processes - Solid Insulation Compounds
General purpose insulation; high-speed or thin-wall insulation - SPECTRA™ Plating Baths
Bright nickel electrolytic plating processes that provides ductile deposits with brightness, leveling, and throwing power - Start-Up Compounds
PE-based purge compound is an advanced compound that provides rapid and economical cleaning of plastic processing equipment - SUBA™ Pads
Polishing pads for stock, intermediate and final polish - SUPER STRIP Metal Strippers
High-speed processes for stripping gold and gold alloys from all base metals - SURFACESTRIP™ Resist Strippers
Alkaline products for stripping aqueous and semi-aqueous dry films - TINGLO CULMO™ Plating Baths
Electronic finishing application for extremely bright tin deposits - TINPOSIT™ Immersion Plating Baths
Immersion plating baths for depositing tin onto copper, copper-based alloys and electroplated tin/lead - TYRIN™ Chlorinated Polyethylene
TYRIN™ chlorinated polyethylene, a product of The Dow Chemical Company, offers excellent flexibility and resistance to ignition, chemicals, heat, low temperatures and weathering at a low overall system cost. - UCON™ Fluids H, HB, and LB Series
Emollients - UCON™ Formulated Fluids and Lubricants
The broad product line of UCON™ formulated fluids and lubricants, including compressor lubricants and base stocks products that can outperform petroleum oils. - ULTRATARTRAL™ Plating Baths
Tartrate-based alternative to cyanide based copper plating baths - UVN™
DUV photoresists - UV™
248nm DUV photoresists - VALTEK™ Plating Baths
Bright tin electroplating processes for electrical connectors - VERSIFY™ Plastomers and Elastomers
VERSIFY™ Plastomers and Elastomers are a versatile family of specialty propylene-ethylene copolymers produced with a revolutionary catalyst in combination with Dow’s proprietary INSITE™ Technology and Solution Process. - Vinyl Acetate Monomer (VAM)
Used as a starting material in the manufacture of films for food packaging - VISIONPAD™
Copper barrier chemical mechanical polishing pads - VORACOR™ Polyurethane Components
PU Systems for the production of Rigid Face DCP - VORANATE™ Isocyanates
TDI for cushioning and NVH; Hot and Cold Molding; Open and Closed Pour; HR (High Resilience) Molding; TDI Molding; Formulating (Systems); Flexible Slabstock Foaming - VORANATE™ Polyurethane Components
Used in the production of elastomers, coatings, adhesives, semi-flexible foams, and carpet underlayment and backing - VORANOL™ Formulated System
Help avoid undesirable foam attributes - VORATEC™ Polyurethane Components
Designed for the production of expanded rigid foams