Innovative Next Generation Technology
Applications

2010 Databook   Download PDF   View Interactive

Elements of Market Success

• Industry leadership position in key electronic materials segments, including #1 or #2 position in: chemical mechanical planarization pads/slurries, semiconductor photolithography materials and metallization for circuit boards
• Broadest portfolio of enabling water purification components, including #1 positions in reverse osmosis membranes and ion exchange resins
• Strong positions in high-growth industries, including water, electronics, food, pharmaceuticals and personal care
• Customer intimacy model in which product development evolves with customers' changing needs
• Deep application knowledge that facilitates world-class technical service
• Speed of technology and new product development to meet rapidly changing market demands

Elements of Profitability

• Expansion into faster growing markets that value innovation
• Continuous innovation to maintain leading-edge technologies for rapidly changing industry dynamics and customer needs
  
• Geographic presence of physical and intellectual assets to enhance customer intimacy
• Close and multi-faceted collaboration with customers who value innovative, customized solutions and speed
• Accelerated investments to maximize new opportunities and customer growth
• Strong intellectual property to provide the next generation of solutions
• Opportunistic bolt-on acquisitions to supplement organic growth and broaden technology platforms

Dow Electronic Materials

Dow Electronic Materials develops and markets highly sophisticated materials used in the electronic materials segment of the global electronics value chain. The business, with a significant presence and operations throughout Asia Pacific, delivers cutting-edge technology, provides strong technical support and closely partners with industry leading customers to develop next generation materials. Its key end-use applications include a broad range of consumer electronics from personal computers to television monitors, cellular phones, global positioning systems, automobile safety systems and avionics.

Dow Electronic Materials is comprised of four principal business 2009 PRO FORMA SALES units, each serving one or more key segments in the electronic materials space.

• Semiconductor Technologies (ST) serves the integrated circuit fabrication market segment with a wide range of technologies used by nearly all of the industry's top semiconductor manufacturers.
• Interconnect Technologies (IT) serves the printed circuit board, electronic finishing, industrial finishing and photovoltaic (PV) industries with advanced metallization technologies that improve performance of electronics, enable high-density circuits and increase solar cell efficiency.
• Display Technologies (DT) serves the large and growing market for liquid crystal displays (LCD), including the emerging area of Organic Light Emitting Diodes (OLED), providing technology differentiation in multi-functional and light guide films, LED backlight-optimized films and display chemicals.
• Growth Technologies (GT) serves as a technology and commercial incubation center that focuses on emerging technologies.

Key Competitors

• Cabot Microelectronics, DuPont, Enthone, JSR, MacDermid, Nissan Brewer, Shin-Etsu, Shinwa, Sumitomo, Teijin DuPont, TOK

Key R&D Innovations

• EPIC™ photoresists and AR™ antireflectants designed for the latest immersion lithography processes
• IC1000™ AT next generation CMP pads, including defect reduction, long-life and slurry reduction pads
• VISIONPAD™ CMP Pad series, combining the benefits of hard and soft pads into a single product
• Negative passivation layer technology for next generation LCD televisions
• ENLIGHT™ light induced plating technology for photovoltaic cell manufacturing
• Emissive Materials for OLED Display Technology
• ACuPLANE™ Copper Barrier CMP Solution, which combines the EcoVision™ 4000 CMP Pad and ACuPLANE™ 5000 Series slurries to deliver a "tunable" CMP system
• OptiVision™ CMP pads, which reduce defectivity and cost of ownership for advanced nodes
• Chrome Gleam™ 3C trivalent chrome plating, a hexavalent chrome-free, safer alternative for plating on plastics
• InterVia™ Photodielectric 8023 for advanced semiconductor packaging applications

Recent Strategic Achievements

• Acquired Gracel Display in 2008, strengthening position in OLED materials, an emerging segment for Display Technologies
• Launched the Advanced Packaging business unit within Growth Technologies in 2009, targeting leading positions in metallization, imaging and assembly for the semiconductor packaging sector

Market Growth Opportunities

CMP Pads and Slurries

• Dow is the #1 global leader in CMP (chemical
  mechanical planarization) consumables
• Dow has multiple technology engagements and joint
  development agreements with top-tier semi-
  conductor customers