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Low Application Temperature
Dow has developed a distinct family of products, INFUSE™ Olefin Block Copolymers (OBCs), for non-woven adhesives. These products deliver excellent adhesive performance at application temperatures as low as 120°C versus the conventional application temperatrue of 150°C or above. As shown in the graph, the viscosity of SIS formulated adhesives tend to increase very rapidly at lower application temperatures. Adhesives formulated with INFUSE™ do not demonstrate this same rapid increase in viscosity which enables them to be applied at lower temperatures. These lower temperatures offer a safer working environment and a potential cost savings as end users can down gage the diaper back sheet.
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