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Company:
Acreo AB
Alcatel
AlliedSignal
Amkor
AMP
AT&T Bell Laboratories
Auburn University
AVX
BNR
Chalmers Univ. of Technology
CMD
Delphi Delco
Ericsson
ETH Zurich
ETRI
FAS Technologies
FCT
Ferdinand Braun Inst.
Flextronics
Flip chip Technologies
Fraunhofer IZM Berlin
GA Tech.
GE
Honeywell
Hyundai
IC Interconnect
IMC, Sweden
IMEC, Belgium
Infineon
Ins. for Hi Frequency
Inst. of Optical Research
Intarsia
KAIST
Karl Suss KG
LG
LG/Philips
Linkoping University
Lucent Technologies
M/A COM
Massachusetts Institute of Technology
MCNC
MMS
Motorola
National Semiconductor
Nat'l Defense Research Est.
NC State University
NEC
NORTEL
Northwestern University
NTT
Optimerix
Paul-Drude-Institute
PCB
Rensselaer Polytechnic Inst.
Research Triangle Institute
Royal Institute of Technology, Stockholm
Samsung
Scandmec AB
Shellcase
Siemens AG
Strand
Technische Univeristy Berlin
The Dow Chemical Company
Thomson CSF
Toshiba
TriQuint
TRW
Unitive.
Univ. Kaiserslautern
Univ. of Wisconsin-Madison
University of Arkansas
University of Bristol
University of California, Santa Barbara
University of Maryland
Washington University
Z Systems
Property:
Adhesion
BCB Chemistry
Copper Migration
Cure Kinetics
Dielectric Comparisons
Dielectric Constant
High Frequency Electrical
IR Analysis
Mechanicals (CTE,elong,modulus, etc.)
Optical Transparency
Oxidative Stability
Photo Formulation
Planarization
Refractive Index
Reliability
Stress
Tg
Thermal Stability
Underfill
Water abs.
Process:
Capacitors
CMP
Coating Techniques
Curing
CVD Deposition
Descum
Dry Etching
Electroless Cu
Exposure
Inductors
Large Panel
Nitride Hard Mask
Photo-lithography
Pre-develop Bake
Puddle Develop
Rapid Thermal Curing (RTC)
Resistor Integration
Soft Masking
Spin Coating
Tank Develop
Wire Bonding
Application:
3D Packaging
Antennas
Bumping
CCD
Display
Flat Panel Displays
GaAs, InP
MCMs
Micro Lens Arrays
Optical Apps., Waveguides
Passive Integration
Pixel Detectors
PWB / Microvias
Resin Coated Copper Foil
Rf Microwave Filters, inductors, etc.
Si IC's
SiGe
Stress Buffer
Superconductors
VCSEL
Wafer Bonding
Wafer-Level CSP
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