Residual tensile stress is caused by the coefficient of thermal expansion, CTE, mismatch between polymer and substrate as the film cools down from its cure temperature. It reaches its maximum as thermal cycling reaches its lowest temperature. CYCLOTENE* resin stress on silicon is ca. 28 MPa at 20ºC

Stress vs. Temperature (from wafer bow) on silicon for CYCLOTENE 3000 and 4000 series Resin

Stress vs. Temperature (from wafer bow) on silicon for CYCLOTENE 3000 and 4000 series Resin
[Ref: 1997-3]


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