CYCLOTENE Advanced Electronics Resins

Other Properties

Property Value Additional Information
Moisture Uptake < 0.2% Moisture Absorption
Planarization CYCLOTENE* Resin Planarization Properties
Cure Kinetics Cure Kinetics: Oven and Hot Plate Curing for CYCLOTENE Resins
Copper Migration Negligible Copper Migration chart
Film Thickness - CYCLOTENE 3000 Series Resins Cured Film Thickness Table
Film Thickness - CYCLOTENE 4000 Series Resins Typical Thicknesses after Soft Bake and after Full Photo Processing and Hard Cure


®™* Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow