CYCLOTENE Advanced Electronics Resins

Cure Kinetics

CYCLOTENE* resins cure by a thermally controlled Diels-Alder mechanism. There are no catalysts and nothing is evolved during the cure. Either the maximum temperature or the maximum time for the cure can be controlled.

The following describe oven and hot plate curing for the CYCLOTENE 3000 Resin (dry etch) and CYCLOTENE 4000 Resin (photo) Series of products. All curing must be under nitrogen atmosphere.

CYCLOTENE 3000 Series Resin
Oven Curing
Hot Plate Curing

CYCLOTENE 4000 Series Resin
Oven Curing
Hot Plate Curing


®™* Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow