CYCLOTENE 4000 Resin Hot Plate Curing

Time/Temperature Plot (20 sec Cure Time)

Time/Temperature Plot

Notes:

• Percent of conversion (cure) is time and temperature dependent
  
• Heating is virtually instantaneous when wafer contacts the hot plate
  
• Accuracy in predicting degree of conversion depends on the accuracy of timing the period of heating and the accuracy in the temperature control of the hot plate

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