CYCLOTENE Advanced Electronics Resins

Photosensitive Resins

The CYCLOTENE* 4000 Series advanced electronics resins are photosensitive polymers developed for use in microelectronics applications. These materials are ideal for wafer level applications where a thin dielectric layer is required, or where a protective layer is needed for passivation or chemical resistance.

Characteristics

  • Negative acting
  • Sensitive to G-line, I-line and broad band radiation
  • Solvent development
  • Excellent film retention
  • Excellent planarization
10 µm thick film of CYCLOTENE 4026-46 Resin, exposed on a proximity aligner at a 10 µm gap.
10 µm thick film of CYCLOTENE 4026-46 Resin, exposed on a proximity aligner at a 10 µm gap.

Commercial Products
Product Viscosity (cSt @ 25°C) Cured Film Thickness (µm)
CYCLOTENE 4022-35 Resin 192 2.5 - 5.0
CYCLOTENE 4024-40 Resin 350 3.5 - 7.5
CYCLOTENE 4026-46 Resin 1100 7.0 - 14.0


Developmental Products
Product Viscosity (cSt @ 25°C) Cured Film Thickness (µm)
XU35133 34 0.8 – 1.8
XU35132 96 1.8 – 3.6
XU35075 1950 15.0 – 30.0



Note: The developmental products are made to order. Please inquire about availability.


®™* Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow