An adhesion promoter can be used in conjunction with CYCLOTENE* advanced electronics resins. The interfaces between CYCLOTENE Resins and underlying layers in a device (e.g., metal or inorganics) usually require a surface treatment or preparation to ensure reliable bonding.
In many processes where a polymer resin is used for thin film applications, chemicals are required for bowl clean-up, backside rinse, and edge bead removal. T1100 has been found to work well in these applications and is compatible with most surfaces and equipment materials.
Thin films of photosensitive CYCLOTENE Advanced Electronic Resins are patterned after exposure by using a solvent to dissolve the unexposed areas of the film.
Stripping and/or Rework
Rework is occasionally required when films are inspected and found to have defects, or were misaligned. Films made with photosensitive CYCLOTENE advanced electronics resins can be reworked prior to cure using a series of solvent-based immersion baths, followed by a water rinse.
Primary Stripper A
®™* Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow