Printed Circuit Board Technology

The low dielectric constant, low loss and low hygroscopic expansion (excellent dimensional stability) of CYCLOTENE* resins make them highly desirable as a dielectric matrix for high-density chip carriers/daughter boards and high-frequency telecommunications devices.

BCB-Cu Build-Up Board Sumitomo Bakelite Co., Ltd.

®™^* Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow