Because it does not outgas on cure, CYCLOTENE* resin forms strong, void-free bonds between wafers. This makes it an ideal adhesive for wafer bonding for 3D integration.
BCB’s low dielectric constant and loss, and its ability to tolerate the caustic solutions used to etch silicon, are key advantages in use with MEMS devices.
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3-D Integration
Rensselaer Polytechnic Institute |
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Flow-through Filter Chamber
KTH Royal Institute of Technology Stockholm |
Flow Channel
KTH Royal Institute of Technology Stockholm |
®™* Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow
